Light emitting device and light emitting device package

ABSTRACT

Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application No. 10-2010-0014707 filed on Feb. 18, 2010,which is hereby incorporated by reference in its entirety.

BACKGROUND

Embodiments relate to a light emitting device and a light emittingdevice package.

A light emitting diode (LED) is a semiconductor light emitting deviceconverting current to light. In recent years, as the luminance of theLED increases gradually, the use of the LED as a light source for adisplay, a light source for a vehicle, and a light source for a lightingsystem is increasing. An LED emitting white light and having superiorefficiency may be implemented by using a fluorescent material orcombining individual LEDs that emit three primary colors.

The luminance of the LED depends on various conditions, such as thestructure of an active layer, a light extracting structure capable ofeffectively extracting light to an outside, semiconductor material usedin the LED, a chip size, and the type of a molding member enclosing theLED.

SUMMARY

Embodiments provide a light emitting device and a light emitting devicepackage having a novel structure.

Embodiments also provide a light emitting device and a light emittingdevice package having an enhanced reliability.

Embodiments also provide a light emitting device and a light emittingdevice package being capable of reducing a light loss.

In one embodiment, a light emitting device including: a support member;a light emitting structure on the support member, the light emittingstructure comprising a first conductive type semiconductor layer, asecond conductive type semiconductor layer, and an active layer betweenthe first conductive type semiconductor layer and the second conductivetype semiconductor layer; a protective member at a peripheral region ofan upper surface of the support member; an electrode including an upperportion being on the first conductive type semiconductor layer, a sideportion extended from the upper portion and being on a side surface ofthe light emitting structure, and an extended portion extended from theside portion and being on the protective member; and an insulation layerbetween the side surface of the light emitting structure and theelectrode.

In another embodiment, a light emitting device package includes a lightemitting device, a package body, a lead electrode, and a socket. Thelight emitting device includes: a light emitting structure including afirst conductive type semiconductor layer, a second conductive typesemiconductor layer, and an active layer between the first conductivetype semiconductor layer and the second conductive type semiconductorlayer; a protective member at a peripheral region of an upper surface ofthe support member; an electrode including an upper portion being on thefirst conductive type semiconductor layer, a side portion extended fromthe upper portion and being on a side surface of the light emittingstructure, and an extended portion extended from the side portion andbeing on the protective member; and an insulation layer between the sidesurface of the light emitting structure and the electrode. The packagebody where the light emitting device is disposed. The lead electrode onthe package body, the lead electrode electrically connected to the lightemitting device. The socket electrically connected to the electrode ofthe light emitting device and the lead electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a light emitting device according toan embodiment.

FIG. 2 is a plan view of the light emitting device of FIG. 1.

FIG. 3 is a plan view of a light emitting device according to anotherembodiment.

FIG. 4 is a plan view of a light emitting device according to a modifiedexample.

FIG. 5 is a plan view of a light emitting device according to anothermodified example.

FIGS. 6 to 11 are cross-sectional views illustrating a method formanufacturing a light emitting device according to an embodiment.

FIG. 12 is a cross-sectional view of a first light emitting devicepackage including a light emitting device according to an embodiment.

FIG. 13 is a cross-sectional view of a second light emitting devicepackage including a light emitting device according to an embodiment.

FIG. 14 is an extended cross-sectional view of a light emitting deviceand a socket in the second light emitting device package of FIG. 13.

FIG. 15 is a disassembled perspective view of the light emitting deviceand the socket in the second light emitting device package of FIG. 13.

FIG. 16 is a cross-sectional view of a first modified example of thesecond light emitting device package.

FIG. 17 is a cross-sectional view of a second modified example of thesecond light emitting device package.

FIG. 18 is a disassembled perspective view of a backlight unit includinga light emitting device or a light emitting device package according toan embodiment.

FIG. 19 is a perspective view of a lighting unit including a lightemitting device or a light emitting device package according to anembodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, it will be understood that when a layer(or film) is referred to as being “on” another layer or substrate, itcan be directly on the other layer or substrate, or intervening layersmay also be present. Further, it will be understood that when a layer isreferred to as being “under” another layer, it can be directly under theother layer, and one or more intervening layers may also be present. Inaddition, word “on,” or “under,” are will be described based on theaccompanying drawings.

In the figures, the dimensions of layers and regions are exaggerated forclarity of illustration. In addition, the dimension of each part doesnot reflect an actual size.

Hereinafter, a light emitting device, a method for manufacturing thesame, a light emitting device package, and a lighting system accordingto embodiments will be described with reference to the accompanyingdrawings.

Embodiments

FIG. 1 is a cross-sectional view of a light emitting device 100according to an embodiment, and FIG. 2 is a plan view of the lightemitting device 100 of FIG. 1.

Referring to FIGS. 1 and 2, the light emitting device 100 according tothe embodiment may include a conductive support member 160, a protectivemember 155 at a peripheral region of an upper surface of the supportmember 160, a light emitting structure 145 on the conductive supportmember 160 and the protective member 155, an electrode 128 on the firstconductive type semiconductor layer, and an insulation layer 125 betweenthe light emitting structure 145 and the electrode 128 for insulatingthem. The electrode 128 includes an upper portion electrically connectedto an upper surface of the light emitting structure 145, a side portionextended from the upper portion and formed on a side surface of thefirst conductive type semiconductor layer, and an extended portionextended from the side portion and formed on the protective member 155.

The light emitting structure 145 is a structure generating a light, andincludes at least a first conductive type semiconductor layer 130, anactive layer 140 under the first conductive type semiconductor layer130, and a second conductive type semiconductor layer 150 under theactive layer 140.

The conductive support member 160 and the electrode 128 receive thepower from the external power supply (not shown) and supply the power tothe light emitting device 100.

Here, according to the embodiment, in order to connect the lightemitting device 100 to the external power supply, a wire may beconnected to the extended portion of the electrode 128. Thus, the amountthat the light emitted from the light emitting structure 145 is lost bythe wire can be minimized, and the damage of the light emittingstructure 145 that may be generated when the wire is bonded can beprevented.

Hereinafter, elements of the light emitting device 100 will be describedin detail.

The conductive support member 160 may include at least one selected fromthe group consisting of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo and asemiconductor substrate doped with a dopant.

The reflective layer 157 may be formed on the conductive support member160. The reflective layer 157 reflects light input from the lightemitting structure 145, thereby making it possible to improve the lightextracting efficiency of the light emitting device 100.

The reflective layer 157 may be made of metal having a high reflectionefficiency. For example, the reflective layer 157 may include at leastone of Ag, Al, Pt, Pd, Cu, or an alloy thereof.

An adhesion layer (not shown) may be formed between the reflective layer157 and the conductive support member 160 so as to enhance aninterfacial bonding force, but is not limited thereto.

The protective member 155 may be formed at the peripheral region of theupper surface of the reflective layer 157. The protective member 155prevents the electrical short between the light emitting structure 145and the conductive support member 160.

The protective member 155 may include insulative and transparentmaterials in order to minimize the light loss. For example, theprotective member 155 may include at least one of SiO₂, Si_(x)O_(y),Si₃N₄, Si_(x)N_(y), SiO_(x)N_(y), Al₂O₃, TiO₂, ITO, AZO (aluminum zincoxide), and ZnO.

The ohmic contact layer 156 may be formed on the upper surface of therelective layer 157 and inside the protective member 155. The ohmiccontact layer 156 may form an ohmic contact between the light emittingstructure 145 and the reflective layer 157 or the conductive supportmember 160. For example, the ohmic contact layer 156 may include atleast one of ITO (indium tin oxide), Ni, Pt, Ir, Rh, and Ag.

When the light emitting structure 145 is ohmic-contacted with thereflective layer 157 or the conductive support member 160, the ohmiccontact layer 156 may be omitted.

The light emitting structure 145 may be formed on the ohmic contactlayer 156. The light emitting structure 145 may include at least thefirst conductive type semiconductor layer 130, the active layer 140under the first conductive type semiconductor layer 130, and the secondconductive type semiconductor layer 150 under the active layer 140.

The first conductive type semiconductor layer 130 may include an n typesemiconductor layer. The n type semiconductor layer may includesemiconductor materials having the compositional formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1), such as InAlGaN, GaN,AlGaN, InGaN, AkN, and InN. In addition, the n type semiconductor layermay be doped with n type dopant such as Si, Ge, and Sn.

The active layer 140 may include semiconductor materials having thecompositional formula of In_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1,0≦x+y≦1). The active layer 140 may have a quantum wire structure, aquantum dot structure, a single quantum well structure, or a multiplequantum well (MQW) structure, but the embodiment is not limited thereto.Electrons (or holes) injected through the first conductive typesemiconductor layer 130 may be recombined with holes (or electrons)injected through the second conductive type semiconductor layer 150 atthe active layer 140, so that the active layer 140 emits the light.

The second conductive type semiconductor layer 150 may includes a p typesemiconductor layer. The p type semiconductor layer may includesemiconductor materials having the compositional formula ofIn_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1), such as InAlGaN, GaN,AlGaN, InGaN, AkN, and InN. In addition, the p type semiconductor layermay be doped with p type dopant such as Mg, Zn, Ca, Sr, or Ba.

Meanwhile, the first conductive type semiconductor layer 130 may includep type semiconductor layer, and the second conductive type semiconductorlayer 150 may include n type semiconductor layer. Also, a thirdconductive type semiconductor layer (not shown) including n type or ptype semiconductor layer may be on the second conductive typesemiconductor layer 150. Accordingly, the light emitting device 100 mayinclude at least one of an N-P junction structure, a P-N junctionstructure, an N-P-N junction structure, and a P-N-P junction structure.That is, the embodiment is not limited thereto.

A side surface of the light emitting structure 145 is subject to anisolation etching that separates the plurality of chips as a unit chip.The side surface of the light emitting structure 145 may be inclined bythe isolation etching, and the protective member 155 may be exposed.

In the embodiment, a region on the protective member 155, where theelectrode 128 is located, may be formed by the isolation etching.

The electrode 128 may be connected to the upper surface of the lightemitting structure 145 (that is, the first conductive type semiconductorlayer 130), and at least part of the electrode 128 may be formed on theprotective member 155. That is, the electrode 128 may include an upperportion on the first conductive type semiconductor layer 130, the sideportion extended form the upper portion and formed on a side surface ofthe first conductive type semiconductor layer 130, and the extendedportion extended from the side portion and formed on the protectivemember 155.

The electrode 128 may include conductive material, and, morespecifically, may include a metal or a conductive non-matal forming anohmic contact with the first conductive type semiconductor layer 130.For example, the electrode 128 may include at least one selected fromthe group consisting of Cu, Ti, Zn, Au, Ni, Pt, Ir, Rh, Ag, ITO, IZO(In—ZnO), GZO (Ga—ZnO), AZO (Al—ZnO), AGZO (Al—Ga ZnO), IGZO (In—GaZnO), IrOx, RuOx, RuOx/ITO, Ni/IrOx/Au, Ni/IrOx/Au/ITO, or ZnO. Thebonding metal layer 129 electrically connected to the electrode 128 isconnected to the external power supply by the wire. Thus, the bondingmetal layer 129 may include metal, considering the connection with theexternal power supply and the current transfer characteristics. Forexample, the bonding metal layer 129 may include Ni, Cu, or alloythereof.

Meanwhile, the electrode 128 may have different shapes depending on atransparency of the electrode 128.

As shown in FIGS. 1 and 2, when the electrode 128 includes a transparentmaterial, the electrode 128 may be formed on an entire region of thelight emitting structure 145 and the protective member 155. It isbecause the amount of light that is absorbed by the transparentelectrode 128 among the light emitted from the light emitting structure145 is small.

Also, the electrode 128 may have a predetermined pattern on the lightemitting structure 145, but not limited thereto.

FIG. 3 is a plan view of a light emitting device 100A according toanother embodiment.

When the electrode 128 includes opaque materials, for example, a metalhaving a high conductivity, the electrode 128 may have a predeterminedpattern.

That is, in order to uniformly spread the power to the entire region ofthe upper surface of the first conductive type semiconductor layer 130and to minimize the loss in the light emitted from the light emittingstructure 145, the electrode 128 a may have a predetermined pattern.

For example, as shown in FIG. 3, the electrode 128 a on the firstconductive type semiconductor layer 130 has a pattern with an opening,for example, a grid pattern, a spiral or helix pattern. Also, thepattern with the opening is connected to the extended portion on theprotective member 155 along a line portion on the side surface of thelight emitting structure 145. That ism the side portion of the electrode128 has a line shape. The shape of the electrode 128 a is not limited tothereto.

Meanwhile, the electrode 128 a may have a plurality of layers. Forexample, the electrode 128 a may include a first layer forming an ohmiccontact with the first conductive type semiconductor layer 130, and asecond layer on the first layer. The second layer may include a bondingmetal that the wire can be easily bonded.

In addition, the bonding metal layer 129 may be formed on a part of theelectrode 128 a. The wire may be bonded on the bonding metal layer 129,thereby supplying the power to the light emitting device 100 from theexternal power supply. A plurality of the bonding metal layer 129 may beprovided according to the desion of the light emitting device 100.

In FIG. 3, the line portion of the electrode 128 a and the bonding metallayer 129 are separately formed, and are electrically connected fromeach other. Accordingly, the electrode 128 a and the bonding metal layer129 may have different materials. Thus, the electrode 128 a may includea material having a superior ohmic contact property, and the bondingmetal layer 129 may include a material considering the connection withthe external power supply and the current transfer characteristics.However, the embodiment is not limited thereto.

Thus, as shown in FIGS. 4 and 5, the line portion of the electrode 128 aand the bonding metal layer 129 a and 129 b may include the samematerial and be integrally formed. According to this, the electrode 128a and the bonding metal layer 129 a and 129 b can be formed at the sameprocess, and thus the process can be simplified. Here, as shown in FIG.4, the bonding metal layer 129 a may have a width the same as that ofthe line portion of the electrode 128 a. Selectively, as shown in FIG.5, the bonding metal layer 129 b may have a width larger than that ofthe line portion of the electrode 128 a, and thus the connection betweenthe bonding metal layer 129 b and the external power supply can beeasily performed.

According to the embodiment, the wire is bonded to the electrode 128 or128 a, or the bonding metal layer 129, 129 a, or 129 b on the protectivemember 155, not to the light emitting structure 145. Thus, the lightloss by the wire can be minimized, and the damage of the light emittingstructure 145 that may be generated when the wire is bonded can beprevented.

The insulation layer 125 is formed between the electrode 128 or 128 aand the light emitting structure 145 for isolating them from each other.Thus, the insulation layer 125 is formed on the side surface of thelight emitting structure 145, thereby preventing the electrical shortbetween the light emitting structure 145 and the electrode 128 or 128 a.

Also, the insulation layer 125 may be further formed between theprotective member 155 and the electrode 128, but is not limited thereto.

The insulation layer 125 may include insulative and transparentmaterials in order to minimize the light loss. For example, theinsulation layer 125 may include at least one selected from the groupconsisting of SiO₂, Si_(x)O_(y), Si₃N₄, Si_(x)N_(y), SiO_(x)N_(y),Al₂O₃, and TiO₂.

As another embodiment, in the case that the electrode 128 a has thepredetermined pattern as in FIG. 3, the insulation layer 125 may have ashape corresponding to the pattern of the first electrode 128 a.

Hereinafter, a method for manufacturing the light emitting device 100according to an embodiment.

FIGS. 6 to 11 are cross-sectional views illustrating a method formanufacturing a light emitting device according to an embodiment.

Referring to FIG. 6, the light emitting structure 145 may be formed on asubstrate 110.

The substrate 110 may be made of at least one of, for example, sapphire(Al₂O₃), SiC, Si, GaAs, GaN, ZnO, GaP, InP, and Ge, but is not limitedthereto.

The light emitting structure 145 may be formed on a substrate 110. Thelight emitting structure 145 may include a plurality of semiconductorlayers, and include at least the first conductive type semiconductorlayer 130, the active layer 140 under the first conductive typesemiconductor layer 130, and the second conductive type semiconductorlayer 150 under the active layer 140.

The light emitting structure 145 may be formed, for example, using aMOCVD (Metal Organic Chemical Vapor Deposition) method, a CVD (ChemicalVapor Deposition) method, a PECVD (Plasma-Enhanced Chemical VaporDeposition) method, an MBE (Molecular Beam Epitaxy) method, an HVPE(Hydride Vapor Phase Epitaxy) method, etc., but is not limited thereto.

Referring to FIG. 7, the protective member 155 may be formed on theperipheral region of the upper surface of the light emitting structure145, and the conductive support member 160 may be fomed on the lightemitting structure 145 and the protective member 155.

The protective member 155 may be formed by the deposition process or thephotolithography process, but is not limited thereto.

The conductive support member 160 may be formed by the depositionprocess or the plating process. Alternatively, the conductive supportmember 160 may have a sheet shape, and may be attached. The embodimentis not limited thereto.

Also, the reflective layer 157 may be formed under the conductivesupport member 160 in order to enhance the light extraction efficiency.Further, the ohmic contact layer 156 may be formed between the secondconductive type semiconductor layer 50.

Referring to FIGS. 7 and 8, the substrate 110 may be removed. Thesubstrate 110 may be removed by a laser lift off (LLO) method or anetching method, but is not limited thereto.

Meanwhile, another etching process such as ICP/RIE (Inductively CoupledPlasma/Reactive Ion Etch) may be performed in order to polish thesurface of the first conductive type semiconductor layer 130 exposedafter removing the substrate 110.

Referring to FIG. 9, the light emitting structure 145 is subject to theisolation etching, such that the light emitting structure 145 isseparated to a unit chip, and the insulation layer 125 is formed.

The upper surface of the protective member 155 may be exposed by theisolation etching.

The insulation layer 125 may be formed, for example, using a PECVD(Plasma-Enhanced Chemical Vapor Deposition) method, an E-beam depositionmethod, etc.

The insulation layer 125 may include insulative and transparentmaterials in order to minimize the light loss. For example, theinsulation layer 125 may include at least one selected from the groupconsisting of SiO₂, Si_(x)O_(y), Si₃N₄, Si_(x)N_(y), SiO_(x)N_(y),Al₂O₃, and TiO₂.

The embodiment is not limited to the case that the insulation layer 125is formed on the side surface of the light emitting structure 145. Thus,the insulation layer 125 may be formed on a part of the upper surface ofthe light emitting structure 145.

Referring to FIG. 10, the electrode 128 may be formed to be in contactwith the light emitting structure 145. At least a part of the electrode128 may be formed on the protective member 155. That is, the electrode128 may include the upper portion, the side portion, and the extendedportion. The upper portion is formed on the upper surface of the firstconductive type semiconductor layer 130. The side portion is extendedfrom the upper portion and is formed on a side surface of the lightemitting structure 145. The extended portion is extended from the sideportion and is formed on the protective member 155.

The electrode 128 may include conductive material, and, morespecifically, may include a metal or a conductive non-metal forming anohmic contact with the first conductive type semiconductor layer 130.For example, the electrode 128 may include at least one selected fromthe group consisting of Cu, Ti, Zn, Au, Ni, Pt, Ir, Rh, Ag, ITO, IZO(In—ZnO), GZO (Ga—ZnO), AZO (Al—ZnO), AGZO (Al—Ga ZnO), IGZO (In—GaZnO), IrOx, RuOx, RuOx/ITO, Ni/IrOx/Au, Ni/IrOx/Au/ITO, or ZnO.

The electrode 128 may be formed on the entire regin of the lightemitting structure 145, or may be have the predetermined pattern. Theshaped of the electrode 128 may be determined according to the desion ofthe light emitting device 100 and/or the material of the electrode 128.

Referring to FIG. 11, the bonding metal layer 129 is formed on at leaston the upper portion of the electrode 128 formed on the protectivemember 155, and the wire 127 is bonded to the bonding metal layer to beconnected to the external power supply. Accordingly, the light emittingdevice 100 according to the embodiment is provided.

In the above embodiment, the light emitting device having verticaltopology, but is not limited thereto. Thus, it may be applied to thelight emitting device having lateral topology.

<First Light Emitting Device Package>

FIG. 12 is a cross-sectional view of a light emitting device packageincluding the light emitting device 100 according to the embodiment.

Referring to FIG. 12, the light emitting device package according to theembodiment includes a package body 20, first and second lead electrodes31 and 32 mounted on the package body 20, a light emitting device 100according to the embodiments, which is mounted on the package body 20and electrically connected to the first and second lead electrodes 31and 32, and a molding member 40 enclosing the light emitting device 100.

The package body 20 may be formed including a silicon material, asynthetic resin material, or a metallic material, and may have aninclination surface around the light emitting device 100.

The first lead electrode 31 and the second lead electrode 32 areelectrically separated, and supply an electric power to the lightemitting device 100. Also, the first and second lead electrodes 31 and32 may reflect light generated from the light emitting device 100 tothus increase light efficiency, and may emit heat generated from thelight emitting device 100 to an outside.

The light emitting device 100 may be mounted on the package body 20 oron the first lead electrode 31 or the second lead electrode 32.

For example, the light emitting device 100 may be electrically connectedto the first lead electrode 31 and the second lead electrode 32 by usingthe wire.

According to the embodiment, the wire is bonded to the electrode 128 or128 a, or the bonding metal layer 129, 129 a, or 129 b on the protectivemember 155. Thus, the light loss by the wire can be minimized, and thedamage of the light emitting structure 145 that may be generated whenthe wire is bonded can be prevented

The molding member 40 may enclose and protect the light emitting device100. Also, a fluorescent material may be included in the molding member40 to change the wavelength of light emitted from the light emittingdevice 100.

<Second Light Emitting Device Package>

Hereinafter, the second light emitting device package will be described.However, the contents the same as or similar to the first light emittingdevice package will be simply described or be omitted.

FIG. 13 is a cross-sectional view of the second light emitting devicepackage including the light emitting device 102 according to theembodiment. FIG. 14 is an extended cross-sectional view of a lightemitting device 102 and a socket 200 in the second light emitting devicepackage of 13. FIG. 15 is a disassembled perspective view of the lightemitting device 102 and the socket 200 in the second light emittingdevice package of FIG. 13.

Referring to FIGS. 13 to 15, the second light emitting device packagemay include a package body 20 a, a lead electrode 31 a on the packagebody 20 a, a through electrode 32 a penetrating from the upper surfaceof the package body 20 a to the bottom surface thereof, a light emittingdevice 102 electrically connected to the through electrode 32 a, and asocket 200 electrically connecting the light emitting device 102 and thelead electrode 31 a, and a molding member 40 enclosing the lightemitting device 100.

In the second light emitting device package, the light emitting device102 is electrically connected to the lead electrode by the socket 200,instead of the wire.

Specifically, the socket 200 includes an opening for inserting the lightemitting structure 145, a socket electrode 210 electrically connected tothe electrode 128 of the light emitting device 102, and an insulatingbody 220 insulating the socket electrode 210 and the conductive supportmember 160 of the light emitting device 102.

When the light emitting structure 145 is inserted to the opening, theelectrode 128 and the socket electrode 210 are electrically connected.That is, a part of the socket electrode 210 may protrude toward theinside of the insulation body 220 so that the socket electrode 210 canbe in contact with the electrode 128. In order to the easy contactbetween the electrode 128 and the socket electrode 210, the thickness ofthe insulation body 220 may be substantially the same as that of theconductive support member 160.

As shown in FIGS. 13 to 15, the socket electrode 210 is formed on theoutside of the insulation body 220, and one end of the socket electrode210 is in contact with the electrode 128 and the other end of the socketelectrode 210 is in contact with the lead electrode 31 a. However, theembodiment is not limited thereto. Thus, the socket 200 may have variousshapes.

Meanwhile, as shown FIG. 16, when the socket electrode 210 a is incontact with the bonding metal layer 129 formed on the electrode 128,the socket electrode 210 a may include a concave portion 212 having ashape corresponding to the bonding metal layer 129. However, theembodiment is not limited thereto.

In FIG. 15, the socket electrode 210 is the upper portion of theelectrode 128 formed on the protective member 155 (that is, the extendedportion). However, the embodiment is not limited thereto. As an modifiedexample, as shown in FIG. 17, the socket electrode 210 b may surroundthe side portion of the electrode 128 formed on the side surface of thelight emitting structure 145, and may extend to a part of the uppersurface of the first conductive type semiconductor layer 130.

According to the embodiment, since the power is provided by using thesocket 200 instead of the wire, the light emitting device 102 can beeasily electrically connected to the lead electrode 31 a and the throughelectrode 32 a, compared with the wire bonding process. Also, the lightemitting device 102 can be strongly fixed and coupled to the packagebody 20 a.

The above electrical connection structure is an example. Thus, theembodiment is not limited to the structure including the lead electrode31 a and the through electrode 32 a.

The light emitting device package according to the current embodimentmay mount at least one of the light emitting devices according to theforegoing embodiments, but the present invention is not limited thereto.The light emitting device package may include a plurality of lightemitting device packages which are arrayed on a substrate. A pluralityof optical members, such as a light guide panel, a prism sheet, adiffusion sheet, a fluorescent sheet, and the like may be arranged on apath of light emitted from the light emitting device package. The lightemitting device package, substrate and optical members may function as abacklight unit or lighting unit, and a lighting system may include, forexample, a backlight unit, a lighting unit, an indicator unit, a lamp, astreetlamp, etc.

FIG. 18 is a disassembled perspective view of a backlight unit includinga light emitting device or a light emitting device package according toan embodiment. The backlight unit 1100 of FIG. 18 is one example oflighting systems, and the present invention is not limited thereto.

Referring to FIG. 18, the backlight unit 1100 may include a bottom cover1140, a light guide member 1120 disposed in the bottom cover 1140, and alight emitting module 1110 disposed on at least one side surface of thelight guide member 1120 or under the light guide member 1120. Also, areflective sheet 1130 may be disposed under the light guide member 1120.

The bottom cover 1140 may be formed in a box shape a top surface ofwhich is opened such that the light guide member 1120, the lightemitting module 1110 and the reflective sheet 1130 can be received. Thebottom cover 1140 may be formed of a metal or resin material, but theinvention is not limited thereto.

The light emitting module 1110 may include a substrate 700 and aplurality of light emitting device packages 600 mounted on the substrate700. The plurality of light emitting device packages 600 may providelight to the light guide member 1120. In the light emitting module 1110according to the current embodiment, it is exemplarily shown that thelight emitting device packages 600 are mounted on the substrate 700, butthe light emitting devices according to the embodiments may be mounteddirectly on the substrate 700.

As shown in FIG. 18, the light emitting module 1110 may be disposed onat least one of inner side surfaces of the bottom cover 1140, and thusmay provide light to at least one of the side surfaces of the lightguide member 1120.

It is also to be understood that the light emitting module 1110 may bedisposed under the light guide member 1120 inside the bottom cover 1140to provide light toward a bottom surface of the light guide member 1120.However, since such a constitution may be modified according to thedesign of the backlight unit 1100, the invention is not limited thereto.

The light guide member 1120 may be disposed inside the bottom cover1140. The light guide member 1120 may convert the light provided fromthe light emitting module to a planar light source and guide theconverted plane light source to a display panel (not shown).

The light guide member 1120 may be, for example, a light guide panel(LGP). The LGP may be formed of, for example, one of acryl-series resinsuch as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET),poly carbonate (PC), COC, and polyethylene naphthalate resin.

An optical sheet 1150 may be disposed on the light guide member 1120.

The optical sheet 1150 may include, for example, at least one of adiffusion sheet, a light-condensing sheet, a brightness enhancementsheet and a fluorescent sheet. For example, the optical sheet 1150 maybe configured by the diffusion sheet, the light-condensing sheet, thebrightness enhancement sheet and the fluorescent sheet stacked. In thiscase, the diffusion sheet 1150 diffuses the light emitted from the lightemitting module 1110 uniformly, and the diffused light may be condensedon the display panel (not shown) by the light-condensing sheet. At thistime, the light emitted from the light-condensing sheet is a randomlypolarized light, and the brightness enhancement sheet may increase thepolarization of the light emitted from the light-condensing sheet. Thelight-condensing sheet may be, for example, a horizontal and/or verticalprism sheet. Also, the brightness enhancement sheet may be, for example,a dual brightness enhancement film. Also, the fluorescent sheet may be atransparent plate or film including a fluorescent material.

The reflective sheet 1130 may be disposed under the light guide member1120. The reflective sheet 1130 may reflect light emitted from thebottom surface of the light guide member 1120 toward a light emittingsurface of the light guide member 1120.

The reflective sheet 1130 may be formed of resin material having goodreflectivity, for example, PET, PC, PVC resins, or the like, but theinvention is not limited thereto.

FIG. 19 is a perspective view of a lighting unit including a lightemitting device or a light emitting device package according to anembodiment. The lighting unit 1200 of FIG. 19 is an example of lightingsystems and the invention is not limited thereto.

Referring to FIG. 19, the lighting unit 1200 may include a case body1210, a light emitting module 1230 installed in the case body 1210, anda connection terminal installed in the case body 1210 to be suppliedwith an electric power from an external power source.

The case body 1210 may be preferably formed of a material having goodheat shielding characteristic, for example, a metal material or a resinmaterial.

The light emitting module 1230 may include a substrate 700, and a lightemitting device package 600 mounted on the substrate 700. In the lightemitting module 1230 according to the current embodiment, it isexemplarily shown that the light emitting device packages 600 aremounted on the substrate 700, but the light emitting devices accordingto the embodiments may be mounted directly on the substrate 700.

The substrate 700 may be an insulator substrate on which a circuitpattern is printed, and may include, for example, a general printedcircuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB,etc.

Also, the substrate 700 may be formed of a material to efficientlyreflect light, and a surface thereof may be formed in a color capable ofefficiently reflecting light, for example, white color, silver color, orthe like.

At least one light emitting device package 600 may be mounted on thesubstrate 700. Each of the light emitting device packages 600 mayinclude at least one light emitting diode (LED). The light emittingdiode may include a color LED emitting red, green, blue or white light,and a UV LED emitting ultraviolet (UV).

The light emitting module 1230 may have a combination of several LEDs soas to obtain desired color and luminance. For example, the lightemitting module 1230 may have a combination of a white LED, a red LED,and a green LED so as to obtain a high color rendering index (CRI). Afluorescent sheet may be further disposed on a path of light emittedfrom the light emitting module 1230. The fluorescent sheet converts thewavelength of the light emitted from the light emitting module. Forexample, when the light emitted from the light emitting module 1230 hasa blue wavelength band, the fluorescent sheet may include a yellowfluorescent material, so that the light, which is emitted from the lightemitting module 1230 and passes through the fluorescent sheet, finallyappears as white light.

The connection terminal 1220 may be electrically connected to the lightemitting module 1230 to supply an electric power to the light emittingmodule 1230. As shown in FIG. 19, the connection terminal 1220 may bescrewed and coupled to an external power, but the invention is notlimited thereto. For example, the connection terminal 1220 may be madein a pin type and inserted into an external power, or may be connectedto the external power through a power line.

As described above, the lighting system may include at least one of alight guide member, a diffusion sheet, a light-condensing sheet, abrightness enhancement sheet and a fluorescent sheet on a traveling pathof light to obtain a desired optical effect.

As described above, since the lighting system according to thisembodiment includes the light emitting device or light emitting devicepackage having the enhanced reliability and reducing the light loss, thelighting system can show superior characteristics.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

1. A light emitting device comprising: a support member; a lightemitting structure on the support member, the light emitting structurecomprising a first conductive type semiconductor layer, a secondconductive type semiconductor layer, and an active layer between thefirst conductive type semiconductor layer and the second conductive typesemiconductor layer; a protective member at a peripheral region of anupper surface of the support member; an electrode comprising an upperportion being on the first conductive type semiconductor layer, a sideportion extended from the upper portion and being on a side surface ofthe light emitting structure, and an extended portion extended from theside portion and being on the protective member; and an insulation layerbetween the side surface of the light emitting structure and theelectrode.
 2. The light emitting device of claim 1, further comprising abonding metal layer on at least a part of the extended portion.
 3. Thelight emitting device of claim 1, wherein the side surface of the lightemitting structure is inclined.
 4. The light emitting device of claim 1,wherein the insulation layer comprises at least one selected from thegroup consisting of Si0₂, Si_(x)O_(y), Si₃N₄, Si_(x)N_(y), SiO_(x)N_(y),Al₂O₃, and TiO₂.
 5. The light emitting device of claim 1, wherein thesupport member comprises an electrically conductive material.
 6. Thelight emitting device of claim 1, wherein the electrode comprises ametal having an electrical conductivity and forming an ohmic contactwith the first conductive type semiconductor layer.
 7. The lightemitting device of claim 1, wherein the upper portion comprises apattern.
 8. The light emitting device of claim 7, wherein the upperportion has an opening.
 9. The light emitting device of claim 7, furthercomprising a bonding metal layer on at least a part of the extendedportion, wherein the upper portion and the bonding metal layer isconnected to the bonding metal layer by a line portion.
 10. The lightemitting device of claim 9, wherein the bonding metal layer and the lineportion are integrally formed.
 11. The light emitting device of claim 9,wherein the bonding metal layer has a width the same as or larger thanthat of the line portion.
 12. The light emitting device of claim 1,wherein the electrode is formed on an entire region of the lightemitting structure and the protective member.
 13. The light emittingdevice of claim 12, wherein the electrode comprises at least oneselected from the group consisting of a metal and a transparentconductive material.
 14. A light emitting device package comprising: alight emitting device comprising: a light emitting structure comprisinga first conductive type semiconductor layer, a second conductive typesemiconductor layer, and an active layer between the first conductivetype semiconductor layer and the second conductive type semiconductorlayer; a protective member at a peripheral region of an upper surface ofthe support member; an electrode comprising an upper portion being onthe first conductive type semiconductor layer, a side portion extendedfrom the upper portion and being on a side surface of the light emittingstructure, and an extended portion extended from the side portion andbeing on the protective member; and an insulation layer between the sidesurface of the light emitting structure and the electrode, a packagebody where the light emitting device is disposed; a lead electrode onthe package body, the lead electrode electrically connected to the lightemitting device; and a socket electrically connected to the electrode ofthe light emitting device and the lead electrode.
 15. The light emittingdevice package of claim 14, wherein the light emitting device furthercomprises a conductive support member under the light emittingstructure, and wherein the light emitting device package furthercomprises a through electrode electrically penetrating the package bodyto be connected to the conductive support member.
 16. The light emittingdevice package of claim 14, wherein the socket comprises an opening forinserting the light emitting structure.
 17. The light emitting devicepackage of claim 15, wherein the socket comprises a socket electrodeelectrically connected to the extended portion of the light emittingdevice, and an insulating body insulating the socket electrode and theconductive support member.
 18. The light emitting device package ofclaim 17, further comprising a bonding metal layer on at least a part ofthe extended portion.
 19. The light emitting device package of claim 18,wherein the socket electrode comprises a concave portion having a shapecorresponding to the bonding metal layer.
 20. The light emitting devicepackage of claim 14, wherein the socket surrounds the side portion.